Meet Smart-core Cloud at electronica 2026 | Hall C2, Booth 660
2026-10-20
electronica is the world’s leading trade fair for electronics.
Smart-core Cloud will be exhibiting at Hall C2, Booth 660. Come and meet our team to learn about our full-stack solution design services, including chip selection, algorithm development, edge computing deployment and system integration. Our experienced specialists will be on hand to discuss your technical challenges and develop customised solutions for your projects.
Dates: 10–13 November 2026
Venue: Messe München
Booth: Hall C2, Booth 660
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SMART‑CORE CLOUD PTE LTD has officially opened its new office in Paya Lebar, Singapore.
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Everest Semiconductor’s product portfolio covers full-series audio ADC, DAC and CODEC chips, fully adapting to diversified application scenarios including smart speakers, soundbars, smart TVs, wearable devices, digital walkie-talkies and automotive electronic equipment.
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In June 2026, global semiconductor market sales hit USD 134.45 billion, representing a 123.6% year‑on‑year increase and 16 straight months of sequential growth, standing at an all‑time high.
Contact 10Marina Boulevard #47-01 Marina Bay Financial CentreTower 2 Singapore 018983 TEL：00852-6763-0779 E-mail：sales@smartcore-cloud.com
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