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News

Discover the latest developments of SMCC

  • TE Raychem OHVT-72CW-I39A-83-B4A 72kV Termination | Smart Grid & Renewable Energy

    2026-05-22

    OHVT-72CW-I39A-83-B4A is a 72kV heat-shrink outdoor termination from TE Raychem, part of the OHVT series.

  • TE Connectivity 208480-3 Circular Connector | 22-Position Power & Signal Solution

    2026-05-22

    208480-3 is a standard circular connector plug assembly from TE Connectivity, part of TE CMC Series 4.

  • TE Connectivity BTJ722E01C-513 Connector Module | High Reliability for Auto & Industry

    2026-05-22

    BTJ722E01C-513 is a high-performance terminal connection module from TE Connectivity Deutsch Connectors series.

  • TE Connectivity 20014756-00 WIM Sensor | High-Precision Dynamic Vehicle Weighing

    2026-05-22

    20014756-00 is a quartz WIM (Weigh-In-Motion) sensor designed specifically for dynamic weighing applications, part of TE Connectivity’s transportation sensing product line.

  • Honeywell 1800-L575-01G Pressure Sensor | High Stability & IP65 Protection

    2026-05-22

    1800-L575-01G is a high-performance silicon pressure sensor developed and manufactured by Honeywell, part of the Honeywell JZ silicon pressure product line.

  • TE Connectivity 7-1616353-7 Current Transformer | High Accuracy Current Sensing

    2026-05-22

    The 7-1616353-7 is a RoHS-compliant, lead-free current transformer primarily used for detecting, converting, and transmitting current signals in electrical circuits.

  • Samsung & SK Hynix Q1 2026 Earnings Surge Amid Skyrocketing Memory Chip Prices

    2026-05-21

    Amid a sharp surge in memory chip prices, Samsung Electronics and SK Hynix both achieved strong revenue and profit growth in the first quarter of 2026, with both companies disclosing significant price trends for the period.

  • NAND Flash: Everything You Need to Know About Tech, Market, Applications & Trends

    2026-05-20

    In the age of AI advancement and data explosion, NAND Flash is the tiny yet indispensable chip powering our digital lives.

  • Intel – Global Leader in Semiconductor & AI Technology

    2026-05-19

    Intel Corporation, founded on July 18, 1968 by Gordon Moore, Robert Noyce, and Arthur Rock in Mountain View, California, is headquartered in Santa Clara, California. Originally named NM Electronics, it was later renamed Intel, short for "Integrated Electronics".

  • Micron Technology – Global Leader in Innovative Memory & Storage Solutions

    2026-05-18

    Micron Technology, founded in 1978 and headquartered in Boise, Idaho, USA, is one of the world’s top three memory chip manufacturers, alongside Samsung and SK Hynix.

  • On August 23, 2026, Nexperia China held its first new‑product launch event with core management in attendance following the supply‑chain turmoil.

  • All electronic components in daily life fall into two categories: active components and passive components.

  • Based in Australia, Silanna Semiconductor leverages extensive expertise in analog chip design and a modular product development platform to deliver a full range of high-speed ADCs. These products cover resolutions from 10 to 16 bits and sampling rates from 20 to 250 MSPS.

  • From July 7 to 9, 2026, Sjoerd Sjoerdsma, Dutch Minister for Foreign Trade and Development Cooperation, led a delegation of 17 Dutch enterprises to China, covering sectors including logistics, agriculture, and high technology. Chip giants such as ASML and NXP were among the most closely watched participants.

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