1. Product Introduction

The BTT3018EJ is a single-channel low-side smart power switch from Infineon Technologies, designed for automotive and industrial low-side driving applications under Infineon’s PROFET™ smart power switch portfolio. The BTT3018EJ integrates MOSFET power stage, comprehensive protection circuits and diagnostic feedback, capable of driving resistive, capacitive and inductive loads including relays, solenoid valves, LED lighting and small DC motors. During product development, engineers can request BTT3018EJXUMA1 samples and view real-time stock levels via SMCC, an authorized Infineon spot distributor, ensuring stable supply chains throughout R&D validation and mass production phases.

Full Part Number: BTT3018EJXUMA1

Package Form: PG-TSOP-8 thin small outline package, 8 pins

Available Evaluation Board: BTT3018EJDEMOBOARDTOBO1

Key Product Features:

• Single-channel low-side smart power switch

• Operating voltage range: Typical 5V ~ 28V (30V rated)

• On-resistance Rds(on): Typical ~100mΩ grade (refer to datasheet for exact values)

• Output current rating: Approximately 1.8A nominal (subject to package, PCB thermal layout and ambient temperature)

• Comprehensive integrated protection: Short-circuit protection, over-temperature protection, overload protection, under-voltage lockout

• Diagnostic feedback: Fault status output pin to signal MCU of abnormal operating conditions

• 3.3V / 5V logic level input compatible

• AEC-Q100 automotive grade certified (refer to datasheet for exact qualification grade)

2. Technical Specifications

2.1 Power Supply & Operating Conditions

• Supply Voltage Range (Vbb): 5.0V — 28.0V (max 40V transient withstand voltage, verify via official datasheet)

• Quiescent Shutdown Current (Ibb_off): Typical < 5 μA in sleep mode (refer to datasheet for precise values)

• Operating Supply Current (Ibb_on): Dependent on load conditions plus internal circuit power draw

• Logic Input Voltage Threshold: Compatible with 3.3V / 5V MCU logic levels

• Input High Level (VIH): Min 2.0V typical (confirm with official datasheet)

• Input Low Level (VIL): Max 0.8V typical (confirm with official datasheet)

2.2 Power Stage Electrical Parameters

• On-Resistance Rds(on): Typical 100 mΩ — 150 mΩ at 25°C with 1A driving current (refer to datasheet for exact specs)

• Nominal Output Current Iout(nom): Typical 1.8A

• Current Limit Ilim: Defined by internal overload protection circuit, check datasheet for precise clamping threshold

• Off-State Output Leakage Current: < 1 μA typical

2.3 Protection Mechanisms

• Over-Temperature Protection (OTP): Typical shutdown junction temperature at 175°C, with 10°C hysteresis recovery window

• Over-Current Protection (OCP): Automatic shutdown upon short-circuit with intelligent auto-restart logic

• Under-Voltage Lockout (UVLO): Output automatically disabled when Vbb falls below threshold voltage

• Inductive Load Demagnetization Clamp: Typical demagnetization voltage Vdemag = Vbb − 40V (verify via datasheet)

2.4 Diagnostic Functions

Fault Status Output: Open-drain output pin pulled low to indicate fault occurrence

Detectable Fault Types: Over-temperature, over-current, under-voltage (check datasheet for full fault combination list)

2.5 Environmental & Mechanical Specifications

• Operating Ambient Temperature (Ta): -40°C — +125°C (automotive standard temperature range)

• Junction Temperature Range (Tj): -40°C — +150°C

• Storage Temperature (Tstg): -55°C — +150°C

• ESD Withstand Capability: HBM 2kV (confirm exact rating via datasheet)

• Package: PG-TSOP-8 thin 8-pin SMD package without exposed thermal pad

• Pin Pitch: 1.27mm typical

• Typical Package Dimensions: 4.9mm × 3.0mm × 1.1mm (refer to official package drawing for exact dimensions)

3. Application Scenarios

3.1 Automotive Electronics

Relay & Solenoid Valve Driving

Installation Locations: Body Control Module (BCM), Engine Control Unit (ECU), Transmission Control Unit (TCU)

Core Functions: Drive lighting relays, wiper relays, door lock solenoid valves and other vehicle actuators

Design Alternative: Replaces discrete combinations of mechanical relays and external protection circuits to improve integration and long-term reliability

LED Lighting Driver

Installation Locations: Interior ambient light control modules, rear lamp control units, daytime running light drivers

Core Functions: PWM signal input controls LED on/off and brightness. Integrated current limiting reduces external constant-current protection circuit complexity for LED strings

Sensor Power Supply

Installation Locations: Engine management systems, transmission sensor power supply modules

Core Functions: Provide regulated 12V power supply channels for automotive pressure sensors, position sensors and temperature sensors with built-in fault diagnostic feedback

3.2 Industrial Control

PLC & Industrial IO Modules

Installation Locations: Digital output modules of programmable logic controllers

Core Functions: Drive industrial solenoid valves, indicator lamps and low-power control relays

Advantages: Single-chip integration of protection and diagnosis functions, eliminating large quantities of discrete external components

Industrial Motor Driving

Installation Locations: Stepper motor holding brake control units, cooling fan control modules

Core Functions: Low-side ground control for small DC motors and electromagnetic brakes

3.3 Household & White Goods

Solenoid Valve & Water Pump Driving

Installation Locations: Washing machine inlet valves, dishwasher drain pumps

Core Functions: Low-voltage solenoid drive within 220V AC to 12V DC conversion systems

Protection Benefits: On-chip short-circuit and over-temperature protection simplifies system-level safety design requirements

4. Hardware Design Recommendations

4.1 PCB Layout Compatibility

• PG-TSOP-8 package PCB footprint must follow Infineon official package drawing guidelines

• Typical pin pad dimensions: 1.50mm × 0.40mm with 1.27mm pad pitch

• OUT pin carries high load current; PCB copper trace width must be no less than 1.0mm based on 1.8A current carrying capacity evaluation

• GND pins should connect to internal or bottom ground planes via multiple thermal vias to reduce thermal resistance

• This package features non-exposed thermal pad design; heat dissipation primarily relies on component pins and PCB copper traces

4.2 Soldering Process Requirements

Lead-free soldering compatible (RoHS compliant)

Reflow soldering peak temperature: 260°C (follow official MSL rating and recommended thermal profile for exact parameters)

Suggested stencil thickness: 0.125mm — 0.150mm

4.3 Alternative Part Recommendations

4.3.1 Same Product Line Alternatives (Sorted by Current Rating)

Higher current drive capacity requirements: Select higher-rated models from the same product series (e.g. BTT3020EJ or subsequent variants — consult official selection table for full options)

Lower on-resistance requirements: Review low Rds(on) variants within the same PROFET family

4.3.2 Cross-Family Replacement Reference

High-side switch alternatives: Infineon PROFET™ high-side product series (BTS family) with identical protection and diagnostic feature sets, though circuit topology differs requiring corresponding PCB layout adjustments

Non-Infineon Alternatives: NXP, STMicroelectronics, TI and other brands supply low-side smart switches, but parameter discrepancies and packaging differences require one-to-one comparative evaluation before design-in

5. Supply Chain Support Services

As an authorized spot distributor of Infineon, SMCC maintains stable BTT3018EJXUMA1 inventory supply. Drawing on extensive industry expertise and professional technical support, SMCC assists customers with component selection and cross-reference alternative model recommendations to accelerate product development and capture market competitive advantages.

For complete technical documentation, visit Infineon’s official website or contact SMCC, the electronic component spot distributor, to obtain full technical details of BTT3018EJXUMA1.